Product Center
LED&Semiconductor Industry
The 7120/7130 family of 2" and 4"spindle dicing systems delivers a level of affordability and flexibility that is unprecedented in the industry.With four different models to choose from,each optimized for a specific range of applications, the 7100 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.
Application:
• Ceramic Substrates
• Thick-film Devices
• Glass
• Glass on Silicon (Sensors)
• PZT
• SAW Filters
• MEMS
• LED & LED on PCB Packages
• Package Singulation
(BGA, QFN, LTCC)
• Opto-electronic Components
• IC Wafers
Specifications:

Features:
• High accuracy, high throughput and versatility
• Advanced vision automation:
Auto alignment
Auto inspection and cut position correction
• Comprehensive, optimized dicing cycle
• High reliability and maintainability
• User friendly GUI
• Yield enhancement and cost saving capabilities
• Kerf inspection and quality analysis
• Blade wear monitoring and projection
• Spindle load monitoring
• Process data logging and statistical analysis
• Workpiece distortions compensation
• Multi-panel handling
• Blade dressing

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