AE- Full Automatic Wafer Mounting System
AE's AWM-8200 combines efficient material handling with advanced processing design to provide accurate, high-throughput mounting of wafers on dicing frames for dicing. Proper tape tensioning and bubble-free mounting are critical elements for consistent, reliable dicing results. The AWM-8200 provides adjustable tape tensioning and air-bubble free mounting results, controlled by its integrated PC. The AWM-8200 accurately mounts thin wafers don to 100µm on all tapes of dicing frame up to 8” using N