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LED&Semiconductor Industry
AE- Full Automatic Wafer Mounting System
AE's AWM-8200 combines efficient material handling with advanced processing design to provide accurate, high-throughput mounting of wafers on dicing frames for dicing. Proper tape tensioning and bubble-free mounting are critical elements for consistent, reliable dicing results. The AWM-8200 provides adjustable tape tensioning and air-bubble free mounting results, controlled by its integrated PC. The AWM-8200 accurately mounts thin wafers don to 100µm on all tapes of dicing frame up to 8” using N
Specifications：
Features：
1. Controlled, Programmable Tape Tension.
2. Easy-to-Use PC Controlled with Windows Touch Screen Operator Interface.
3. Accommodates Dicing Film Frame Sizes, Up to 8".
4. Unique patent vacuum mounting technology without roller
5. Configure with multi link wafer transfer robot
6. Bernoulli arm for thinner wafer handling
7. Wafer position & warpage intelligent mapping
8. Fiber sensor for wafer alignment
9. Non-contact / contact chuck to handle various wafer
10. Wafer cassette loading & unloading (Box Optional)
11. Full ST.ST. covers & doors with aluminum profile frame
12. Built-in Ionizers stick for ESD protection
13. Non-UV & UV tape capability
14. Safe, Simple, Accurate Operation
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Hong Kong Headquarters
Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong
Telephone:+852 28662978
Fax:+852 28662013
Email:admin@bb-technology.com.hk
Xiamen Office
Telephone:+86 (592) 5083007/5083006
Taiwan Office
Telephone:+886-2-77253668
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