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ADT UV 955

ADT UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
The systems are offered in two basic configurations:
UV 955-8" – round wafer up to 8"
UV 955-12" – round wafer up to 12"

Specifications：


Model 955 – 8"

Model 955 - 12"

Max. wafer size

Ø 200 mm

Ø 300 mm

Effective UV wavelength

365 nm

365 nm

Throughput

50/小时

50/小时

Machine dimensions (WxDxH)

508 x 450 x 120 mm

645 x 525 x 180 mm

Approx. machine weight

20 kg

25 kg

Features：

• Intuitive control panel
• Enabled time control process   
• Compact design
• Compliance with highest safety standards
• Environmentally friendly
• Options:
  * Anti-ozone nitrogen distribution kit
  * Alarm buzzer

Previous : ADT 966- Manual Wafer Mounter System Next : AE- Full Automatic Wafer Mounting System
ADT UV 955
ADT UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
The systems are offered in two basic configurations:
UV 955-8" – round wafer up to 8"
UV 955-12" – round wafer up to 12"
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    Hong Kong Headquarters

           Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong

           Telephone:+852 28662978

           Fax:+852 28662013

           Email:admin@bb-technology.com.hk

    Xiamen Office

           Telephone:+86 (592) 5083007/5083006

    Taiwan Office

           Telephone:+886-2-77253668

    Hong Kong Headquarters

    Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong

    Telephone:+852 28662978

    Fax:+852 28662013

    Email:admin@bb-technology.com.hk

    Xiamen Office

    Telephone:+86 (592) 5083007/5083006

    Taiwan Office

    Telephone:+886-2-77253668

    Copyright © BB Technology PTE Ltd and BBT Scientific Engineering Limited   

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