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LED&Semiconductor Industry
ADT 977 Wafer Clean Systems
ADT 977 Wafer Cleaner System is designed for cleaning work pieces after dicing.The systems are offered in three basic configurations :
WCS-977 – round wafer up to 8"
WCS-977LA – round wafer up to 12"
WCS-977D – a standalone coating/de-coating station with:
*Wafer spin coating technology
*Absolute surface protection during dicing
*100% removal of contamination and residue
*Atomized cleaning and N2 drying
. Compact design
. Atomizing or High pressure cleaning
. Easy to use - one touch activatio
Specifications:
977- 200 | 977L - 300 | |
Max. wafer size | Ø 200 mm | Ø 300 mm |
Cleaning method | Atomizing cleaning / High pressure cleaning | Atomizing cleaning / High pressure cleaning |
Number of recipes that can be saved | 8 | 8 |
Spinner velocity range | 200-3000rpm | 200–2500 rpm |
Machine dimensions (WxDxH) | 410 x 625 x 950 mm | 410 x 625 x 950 mm |
Approx. machine weight | 100 kg | 160 kg |
Features：
• Atomizing cleaning
• Automatic lid closing
• Intuitive control panel
• Process monitoring
• Compact design
• Robust, vibration free
• Environmentally friendly
• Options:
* Build-in mist exhaust unit
* CO2 injection
* Customized chucks
* Cleaning additives
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Hong Kong Headquarters
Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong
Telephone:+852 28662978
Fax:+852 28662013
Email:admin@bb-technology.com.hk
Xiamen Office
Telephone:+86 (592) 5083007/5083006
Taiwan Office
Telephone:+886-2-77253668
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